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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

Brand Name:	Customized
MOQ:	1 paneel
Prijs:	Onderhandelbaar
Payment Terms:	T/T

Detail Information

Productomschrijving

Detail Information

Place of Origin:

China

Certificering:

ISO9001, ISO13485,IS014001

Bordtype:

6 lagen

Basismateriaal:

FR4/ROGERS/Hoge Tg

Soldermasker:

Groen soldeer masker

Minimale brug met soldeermasker:

0,1 mm

Oppervlakteafwerking:

EING

Servicetype:

PCB-prototype/massaproductie

Maat:

Aangepast

Cu -dikte:

1 oz

Maximale substraatgrootte:

24×32×

Verpakking Details:

Vacuümpakket

Markeren:

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Productomschrijving

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

Circuit width and spacing limits
Annular ring and aspect ratio limits, especially for high reliability designs and requirements
Material choice used in the board to ensure impedance control in the required stackup
Impedance profiles for the desired stackup or layer pairs if available
Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type 0

Markeringen:

Flexibele PCB-Raad

stijve PCB

koperpcb

Stijve flexibele printplaat

De Raad van aluminiumpcb

hdipcb

Zware Koperpcb

Roger pcb

De LEIDENE Raad van PCB

Power PCB-assemblage

PCB-het Winden

Snelle Draaipcb

Hoge Frequentiepcb

EMS-de Assemblage van PCB

Flexibele PCB-Raad

stijve PCB

koperpcb

Stijve flexibele printplaat

De Raad van aluminiumpcb

hdipcb

Zware Koperpcb

Roger pcb

De LEIDENE Raad van PCB

Power PCB-assemblage

PCB-het Winden

Snelle Draaipcb

Hoge Frequentiepcb

EMS-de Assemblage van PCB

products details

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description:

HDI PCB Design DFM Requirements